Advanced Packaging - IEEE - News Items
![Advanced Packaging, IEEE Transactions on [see also Components, Packaging and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on] - new TOC](/modules/tRSSNews/pnimages/feedimages/blank.gif)
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Collimated Aerosol Beam Deposition: Sub-5-$mu$m Resolution of Printed Actives and Passives
Friday, July 30, 2010 - 04:19 AM - 18 hours, 19 minutes ago - Electrical Engineering - Advanced Packaging - IEEE
Materials deposition based upon directed aerosol flow has the potential of finding application in the field of flexible electronics where a low-temperature route to printed transistors with high ... (Read More)
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Correction to “Laser-Assisted Sealing and Testing for Ceramic Packaging of MEMS Devices” [Aug 03 283-288]
Saturday, May 29, 2010 - 04:20 AM - 2 months ago - Electrical Engineering - Advanced Packaging - IEEE
In the above titled paper (ibid., vol. 26, no. 3, pp. 283-288, Aug. 03), the biography of Ajay P. Malshe should have appeared as it is presented here.
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Table of contents
Thursday, May 13, 2010 - 04:19 AM - 2 months, 2 weeks ago - Electrical Engineering - Advanced Packaging - IEEE |
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IEEE Components, Packaging, and Manufacturing Technology Society information for authors
Thursday, May 13, 2010 - 04:19 AM - 2 months, 2 weeks ago - Electrical Engineering - Advanced Packaging - IEEE |
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IEEE Components, Packaging, and Manufacturing Technology Society Information
Thursday, May 13, 2010 - 04:19 AM - 2 months, 2 weeks ago - Electrical Engineering - Advanced Packaging - IEEE |
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Effects of Warpage on Fatigue Reliability of Solder Bumps: Experimental and Analytical Studies
Thursday, May 13, 2010 - 04:19 AM - 2 months, 2 weeks ago - Electrical Engineering - Advanced Packaging - IEEE
Out-of-plane displacement (warpage) has been a major thermomechanical reliability concern for board-level electronic packages. Printed wiring board (PWB) and component warpage results principally ... (Read More)
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Packaging of Dual-Mode Wireless Communication Module Using RF/Optoelectronic Devices With Shared Functional Components
Thursday, May 13, 2010 - 04:19 AM - 2 months, 2 weeks ago - Electrical Engineering - Advanced Packaging - IEEE
This paper reports the design, fabrication, and testing of a compact radio-frequency (RF)/ free space optical (FSO) dual mode wireless communication system. A modified split dual-director ... (Read More)
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Distribution and Diffusion of Water in Model Epoxy Molding Compound: Molecular Dynamics Simulation Approach
Thursday, May 13, 2010 - 04:19 AM - 2 months, 2 weeks ago - Electrical Engineering - Advanced Packaging - IEEE
The distribution and diffusion of water with various water content in a fully crosslinked epoxy molding compound was simulated using a parallel full-atomistic molecular dynamics simulation ... (Read More)
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Lead-Free Solder Material and Chip Thickness Impact on Board-Level Reliability for Low-K WLCSP
Thursday, May 13, 2010 - 04:19 AM - 2 months, 2 weeks ago - Electrical Engineering - Advanced Packaging - IEEE
This paper evaluates the effect of the solder ball material and chip thickness on board-level reliability using low-K wafer-level chip-scale packaging (WLCSP). The composition of the three ... (Read More)
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Dynamics of Contact Wave in Silicon Wafer Direct Bonding
Thursday, May 13, 2010 - 04:19 AM - 2 months, 2 weeks ago - Electrical Engineering - Advanced Packaging - IEEE
A quantitative description of the dynamics of silicon wafer direct bonding is proposed, and the contact wave for bonding front propagation is modeled as a function of time. The changes in exhaust ... (Read More)
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Comments on “Influence of Interfacial Compliance on Thermomechanical Stresses in Multilayered Microelectronic Packaging”
Thursday, May 13, 2010 - 04:19 AM - 2 months, 2 weeks ago - Electrical Engineering - Advanced Packaging - IEEE
An approach previously developed by Suhir in 1986 for calculating the interfacial compliance of a long-narrow strip is a general, explicit method, but Basaran and Wen claimed that there had been ... (Read More)
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The Investigation of Nano-Roughening Effect on the Reliability Enhancement of Adhesive Bond for NEMS Manufacture Application
Thursday, May 13, 2010 - 04:19 AM - 2 months, 2 weeks ago - Electrical Engineering - Advanced Packaging - IEEE
The paper shows the importance of nano-roughening on the bonding interface to the reliability enhancement of adhesive bond for ensuring the continuation of packaging shrinkage from MEMS to NEMS. ... (Read More)
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An Integration Technology for RF and Microwave Circuits Based on Interconnect Programming
Thursday, May 13, 2010 - 04:19 AM - 2 months, 2 weeks ago - Electrical Engineering - Advanced Packaging - IEEE
A configurable integration technology suitable for implementing application specific radio-frequency (RF) and microwave circuits is presented. This postfabrication integration scheme is ... (Read More)
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Synthesis of High-Quality Vertically Aligned Carbon Nanotubes on Bulk Copper Substrate for Thermal Management
Thursday, May 13, 2010 - 04:19 AM - 2 months, 2 weeks ago - Electrical Engineering - Advanced Packaging - IEEE
Vertically aligned carbon nanotubes (VACNTs) grown on bulk copper substrate are of great importance for real-life commercial applications of carbon nanotubes (CNTs) as thermal interface materials ... (Read More)
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Design and Development of Fine Pitch Copper/Low-K Wafer Level Package
Thursday, May 13, 2010 - 04:19 AM - 2 months, 2 weeks ago - Electrical Engineering - Advanced Packaging - IEEE
Copper (Cu)/low-dielectric constant (K) structures are desired choices for advanced integrated circuits (ICs) as the IC technology moving towards fine pitch, high speed, increased integration and ... (Read More)
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Aligning Chips Face-to-Face for Dense Capacitive and Optical Communication
Thursday, May 13, 2010 - 04:19 AM - 2 months, 2 weeks ago - Electrical Engineering - Advanced Packaging - IEEE
We report a new method that precisely self-aligns face-to-face semiconductor chips or wafers to enable communication between the chips using electromagnetic waves. Our alignment mechanism takes ... (Read More)
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Wafer Level Processing of Integrated Passive Components Using Polyimide or Polybenzoxazole/Copper Multilayer Technology
Thursday, May 13, 2010 - 04:19 AM - 2 months, 2 weeks ago - Electrical Engineering - Advanced Packaging - IEEE
Focus of this work was the development and optimization of process techniques for the application of Polyimide (PI) or Polybenzoxazole (PBO) to act as dielectric material together with ... (Read More)
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Electronic Packaging Materials for Extreme, Low Temperature, Fatigue Environments
Thursday, May 13, 2010 - 04:19 AM - 2 months, 2 weeks ago - Electrical Engineering - Advanced Packaging - IEEE
Electronic packaging technology has been developed to withstand extreme temperature fatigue conditions from ${- 120},^{circ}{rm C}$ to ${+ 85},^{circ}{rm C}$ for over 1500 cycles. This ... (Read More)
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Collimated Aerosol Beam Deposition: Sub-5- m Resolution of Printed Actives and Passives
Thursday, May 13, 2010 - 04:19 AM - 2 months, 2 weeks ago - Electrical Engineering - Advanced Packaging - IEEE
Materials deposition based upon directed aerosol flow has the potential of finding application in the field of flexible electronics where a low-temperature route to printed transistors with high ... (Read More)
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Development of Optical Subassembly for Plastic Optical Fiber Transceiver in High-Speed Applications
Thursday, May 13, 2010 - 04:19 AM - 2 months, 2 weeks ago - Electrical Engineering - Advanced Packaging - IEEE
A low-cost optical subassembly design for large core fiber transceiver is presented. The complete transceiver module is realized by assembling the low-cost optical subassembly directly on the ... (Read More)
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